|
經營團隊
Chairman/President
Eugene Huang
Mr. Huang joined Teco Image Systems (TIS) as Vice President of Operations in 2001, and was promoted to President in October of 2002. During his tenure, Mr. Huang has been responsible for expanding revenues, improving earnings-per-share by more than 2.5 times, and solidifying the company's position as global leader in MFP OEM/ODM solutions. Mr. Huang has also been responsible for strategic investment and completion of the company's ultra-modern manufacturing facilities in Suzhou, China.
Prior to joining TIS, Mr. Huang was responsible for business development at United Microelectronics Corporation, the world's second largest semiconductor foundry. Mr. Huang's exposure to international new business development, marketing strategy, corporate management, and semiconductor and microelectronics industries has enabled him to effectively guide the development and deployment of TIS' highly successful services and solutions.
Mr. Huang earned BS and Master's degrees in Electrical Engineering from Columbia University (USA) as well as a BA degree in Business Management from Japan's Keio University.
Senior Vice President
Ben Sung
Mr. Sung joined Teco Image Systems (TIS) as a Senior Vice President in 2017, and he has a responsibility for operational
excellence of TDS (TIS Dongguan Factory) and Technology innovation of production engineering.
To reach world class factory operation, he chases TDS factory optimization and Innovation.
For the target of industry 4.0, production innovation and automation would be focused with ICT (Information & Communication Technology) and Cobots (Collaborative Robots).
Prior to joining TIS, Mr. Sung was responsible for manufacturing global operation at LG Electronics, one of the best global consumer electronics company. Mr. Sung also had experiences
of overseas subsidiary president and made outstanding performances through factory innovation and lots of operational excellences.
Mr. Sung had a BS in Electronics from Sung Kyun Kwan University in Korea.
CTO
Tom Wei
Mr. Wei joined Teco Image Systems (TIS) in 1997 as Assistant
Manager for the company's Telecommunications Product Division,
has since then served as Research and Development Division
Manager and Vice President of R&D Operations, and now
currently serves as Associate Vice President. Mr. Wei first
joined the Teco Group of companies in 1981 and has since held
numerous management level positions within Teco Electric,
Teco Information Systems and Teco Image Systems.
Mr. Wei brings extensive product research and development
experience and expertise to TIS. His direct work experience
spans hardware design, software and firmware design, control
systems, communications, optical systems, ASIC and system
integration. Mr. Wei has played a lead role in the introduction
of new products and technologies within the Teco Group, from
the company's first thermal fax to today's increasingly sophisticated
MFP devices, and is responsible for TIS' leadership position
within the Taiwan industry.
Mr. Wei holds a BS in Electronics from Chung Yuan University.
|
|